Mechanical properties of new integrated flexible electronics based on doped thermoplastics

Mechanical properties of new integrated flexible electronics based on doped thermoplastics

Internship Description

An iinternship opportunity is available within the framework of a research project related to future flexible electronics. These are usually made of a transparent electrode (ITO) deposited on a polymer substrate. Such design results in loss of integrity when cracks develop in the thin brittle electrode. This project intends to characterize mechanical prooerties of new technologies for which the electrode and the substrate are merged together into a single active layer. The project will cover fatigue dependent properties as well as piezoresistive effects. The student is expected to participate in writing journal publications and presenting research at conferences. ​​​

Faculty Name

Gilles Lubineau

Field of Study

​Mechanical Engineering