More Than Natural Skin

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Project Description

Natural skin is an engineering wonder due to its multisensory capability in a singular platform with simultaneous sensing capability. At the same time, many people have been suffering from skin burns and damages due to acid, burn, wound, etc. Therefore it is an important scientific and engineering challenge to develop an affordable and biocompatible artificial multi-sensory mesoporous singular platform like natural skin and then to integrate that with our neurological system. Paper by virtue of its critical role in our daily life, its physical flexibility, ultra-light weight and affordability make it an amazingly simple but effective material for such skin platform. In the recent past, we have demonstrated a paper based multisensory singular platform which can perform simultaneous sensing. The developed paper skin shows unprecedented functionality and performance over cost. We have tested its effectiveness as environmental sensor as well as for body vital monitor. Therefore, in this project, we will develop and engineer skin like multi-sensory platform for artificial organs and various wearable applications. ​​​​
Program - Electrical Engineering
Division - Computer, Electrical and Mathematical Sciences and Engineering
Field of Study - Electrical Engineering, Mechanical Engineering, Bio Engineering, Computer Science (Robotics, Automation), Civil Engineering (Structural Engineering), Physics, Material Science and Engineering.

About the
Researcher

Muhammad Mustafa Hussain

Professor, Electrical and Computer Engineering

Muhammad Mustafa Hussain
Prof. Hussain's research is in transformational electronics and includes discovering new applications for web integrated electronics using CMOS compatible processes to transform materials, device architectures, substrates, waste materials into impactful resources including high-performance flexible-stretchable-transparent-reconfigurable inorganic nanoelectronics and nanoelectronic systems.

Desired Project Deliverables

​Literature survey, programing, fabrication, material and device analysis, device characterization, system integration, oral and written reports.​